Latest FSES Visit to Shenzhen

Mai 17th, 2019 | Posted by ssheades in 2019 - (Kommentare deaktiviert für Latest FSES Visit to Shenzhen)

In the end of April, Seth Sheades made a successful two week visit to partner Micronic Enterprise Co., Ltd in order to introduce newly integrated Automation features including a Modular Vacuum Plate for small PCB handling and Integrated Compression Hardware for routed panel mounting.

Not all the time was spent working, as we also had time for a rainy game of soccer and several trips to favorite restaurants to test his Chinese culinary skills!

Compression Hardware Introduced

April 5th, 2019 | Posted by ssheades in 2019 - (Kommentare deaktiviert für Compression Hardware Introduced)

In order to handle product with minimal edge clearance, FSES has worked with partner Micronic Enterprise Co., Ltd. to implement a compression solution that fits easily into the stretch frame.

Switching between Compression and Stretch Modes is fast and easy and allows for handling of square product having down to 1mm space on the vertical edges.

Modular Vacuum Plate Introduced

April 3rd, 2019 | Posted by ssheades in 2019 - (Kommentare deaktiviert für Modular Vacuum Plate Introduced)

To extend the specifications of the Dual Sided Automation and meet ever increasing customer demands, FSES has introduced a new, modular vacuum plate.  The different configurations are easily exchanged within 2-3 minutes and require no special tools for switching.

With the Four Row Vacuum Plate product may be handled down to 75mm in height.

Dual Sided Automation at CPCA 2019

März 22nd, 2019 | Posted by ssheades in 2019 - (Kommentare deaktiviert für Dual Sided Automation at CPCA 2019)

The integrated Dual Sided Automation was displayed by partner Shenzhen Micronic Technology Co., Ltd. between March 19-21 at the 2019 CPCA show in Shanghai.

Dual Sided Automation at 2019 CPCA Show